Semiconductor Equipment Manufacturing
Precision Parts for Semiconductor Equipment
Semiconductor equipment manufacturing demands more than tight tolerances. PartsMake delivers production-ready components with material consistency, strict particle control, and rigorous process documentation.
From wafer handling and vacuum systems to motion control, our engineering team connects your CAD designs with reliable hardware through early DFM review and controlled manufacturing processes.
±0.001 mm
Surface grinding capability
0.1 µm
Typical grinding Ra
24 hours
RFQ review target
Built for demanding equipment environments
Low particle generation, dimensional stability, and documented quality.
Engineering-first production
Production confidence starts before machining
We do not simply execute CAD files. Before the first chip is cut, our engineering team reviews each project for manufacturing feasibility, cleanability, structural performance, and inspection strategy.
Discuss your designMaterial traceability
Materials can be sourced to industry standards with certification available upon request.
DFM review
Thin walls, deep pockets, sharp corners, and trapped volumes are reviewed before production.
Risk mitigation
Fixture planning prioritizes critical mating surfaces, tight-tolerance holes, and inspection access.
Manufacturing capabilities
Process capability matched to component complexity
Our multi-axis CNC and precision finishing processes support complex geometries, thin-walled chambers, miniature components, fixtures, and high-performance interfaces.
| Capability | Typical materials | Tolerance capability | Surface finish (Ra) | Key application |
|---|---|---|---|---|
| 5-Axis Milling | Al 6061/7075, Stainless 304/316L | ±0.005 mm | 0.4 µm | Complex vacuum housings |
| Swiss Machining | Stainless, PEEK, Titanium | ±0.002 mm | 0.2 µm | Miniature pins and sensors |
| Mill-Turn | Aluminum, Inconel, Brass | ±0.005 mm | 0.4 µm | Wafer handling shafts |
| Wire EDM | Hardened steel, conductive ceramics | ±0.003 mm | 0.2 µm | Precision fixtures and slots |
| Surface Grinding | Steel, ceramic | ±0.001 mm | 0.1 µm | Mating surfaces |
Application modules
Components designed around equipment function
Performance depends on both geometry and contamination control. We align machining and finishing decisions with the operating environment.
Vacuum Systems
Vacuum housings and internal features are reviewed to eliminate trapped volumes. Parts are produced without burrs and machining oils that could contribute to outgassing or contamination.
Repeatable interfaces
Precision grippers, end effectors, and guide rails are manufactured for low friction, dimensional stability during thermal cycling, and reliable wafer alignment.
Stable movement
For stages, actuators, and positioning systems, we balance mass and stiffness while using stress-relieving processes to limit deformation over long-term operation.
Quality and cleanliness
Control the details that affect integration
For semiconductor equipment, manufacturing does not end at the machine. Post-processing, inspection, and packaging help protect the component from particles, residues, and handling damage.
Precision cleaning
Ultrasonic cleaning and degreasing remove machining fluids, metallic dust, and organic contaminants.
Dimensional verification
CMM and optical inspection verify critical dimensions, position, flatness, and drawing requirements.
Controlled packaging
Final inspection and packaging use anti-static and vacuum-seal bags where required to maintain cleanliness until assembly.
Typical specification checkpoints
Frequently requested details
Clear answers before your RFQ
Request a quote
Move your semiconductor component project forward
Send your technical package and application requirements for an engineering feasibility review. We review RFQs within 24 hours to provide a timeline and manufacturing plan.
Start your project review
Share your requirements with the PartsMake manufacturing team.
PartsMake Manufacturing Facility